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iPhone 6s Teardown P2

Date: 10-25-2016   Click: 104

Step 14

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  • Next out, the iPhone's 12 MP peeper!

  • This year's camera offers a substantial spec bump from the 6, including the first resolution increase since the iPhone 4s.

    • 50% more focus pixels means faster, more accurate autofocus without a drop in quality.

    • The new iSight camera also brings the iPhone into the arena of 4K video recording, which has previously been dominated by Android phones.

  • Increased pixel density often comes at the cost of a decrease in individual pixel quality, due to crosstalk from competing photodiodes, but this new iSight camera includes some cool technologies that mitigate that issue.

    • There are electrically insulating trenches etched between the sensor's photodiodes, a process called Deep Trench Isolation, to compensate for leakage between densely-packed pixels.

Step 15

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  • And now, for a trip into the Twilight Zone...

  • We find a strange 2.5 mm hex head in the place of the more standard stand-off screw. Add a new tool to your smartphone arsenal...

  • And out comes the Lovecraftian antenna unit seen in previous models.

Step 16

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And now, for the moment we've all been waiting for... It's time to reveal some ICs on the front of the logic board:

  • Apple A9 APL0898 SoC + Samsung 2 GB LPDDR4 RAM (as denoted by the markings K3RG1G10BM-BGCH)

  • Qualcomm MDM9635M LTE Cat. 6 Modem (vs. the MDM9625M found in the iPhone 6)

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo (also found in iPhone 6)

  • Bosch Sensortec 3P7 LA 3-axis Accelerometer (likely BMA280)

  • TriQuint TQF6405 Power Amplifier Module

  • Skyworks SKY77812 Power Amplifier Module

  • Avago AFEM-8030 Power Amplifier Module

Step 17

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  • Two more ICs on the front of the logic board:

    • 57A6CVI

    • Qualcomm QFE1100 Envelope Tracking IC

  • Based on alleged schematics leaked last month, the rumor mill had the A9 pegged at a 15% smaller die size from the A8. We can't confirm the die size, but the A9 package itself appears bigger—roughly 14.5 x 15 mm, up from 13.5 x 14.5 mm on the A8. That could represent a smaller die plus the addition of the embedded M9 and other functions.

Step 18

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But wait, there's more! We'll double your order of chips absolutely free!

  • Toshiba THGBX5G7D2KLFXG 16 GB 19 nm NAND Flash

  • Universal Scientific Industrial 339S00043 Wi-Fi Module

  • NXP 66V10 NFC Controller (vs. 65V10 found in iPhone 6)

  • Apple/Dialog 338S00120 Power Management IC

  • Apple/Cirrus Logic 338S00105 Audio IC

  • Qualcomm PMD9635 Power Management IC

  • Skyworks SKY77357 Power Amplifier Module (likely an iteration of the SKY77354)

Step 19

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More ICs on the back of the logic board:

  • Murata 240 Front-End Module

  • RF Micro Devices RF5150 Antenna Switch

  • NXP 1610A3 (likely an iteration of the1610A1 found in the iPhone 5s and 5c)

  • Apple/Cirrus Logic 338S1285 Audio IC (likely an iteration of the 338S1202 audio codec found in the iPhone 5s)

  • Texas Instruments 65730AOP Power Management IC

  • Qualcomm WTR3925 Radio Frequency Transceiver

  • Possibly a Bosch Sensortec Barometric Pressure Sensor (BMP280)

Step 20

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  • Teardown update! It turns out this logic board has a secret weapon: tiny seals surround each of the cable connectors. (They look like black foam hedges surrounding each of the gold connectors.) What can it mean?

  • Answer: we think those are waterproof silicone seals. They appear to match a patent Apple filed back in March for waterproofing board-to-board connectors.

  • When it comes to liquid damage, those cable connectors are among the most vulnerable parts of the phone.

  • This would seem to explain recent tests showing the 6s and 6s Plus to be dramatically more resistant to liquid damage.

Step 21

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  • Time to pick out the last goodies. The first to drop: the bass speaker.

  • A closer look at the speaker reveals... not much, actually.

  • The 6s speaker appears to be a very close cousin to the speaker from the iPhone 6. We suspect the difference in shape can be attributed to the addition of the Taptic Engine.

Step 22

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  • And now, the famous "everything cable" (a.k.a. the Lightning cable assembly), featuring not one, but two microphones!

  • Beyond the two microphones, the Lightning cable assembly plays host to an impressive array of components:

    • Lightning port to meet your charging/data transfer needs.

    • Headphone jack for your audio needs.

    • Cell antenna cables for all your cellular needs.

  • While the Lightning cable assembly is a fine example of engineering efficiency, it doesn't bode well for repairs. A single broken component means the whole cable will need to be replaced.

Step 23

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  • This teardown opens at the close: The final step is the Sleep/Wake button!

  • The large gasket of yore is gone, but there's still some waterproofing going on.

    • That said, this device doesn't come with a water resistance rating, and we do not recommend getting your 6s wet. Water and smartphones are not the best of friends.

Step 24

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  • The display assembly continues to be the first component out, simplifying screen repairs.

  • The battery is straightforward to access. Removing it requires a proprietary pentalobe screwdriver and knowledge of the adhesive removal technique, but is not difficult.

  • The Touch ID cable is still tucked out of the way, but is paired to the logic board, complicating repairs.

  • The iPhone 6s still uses proprietary Pentalobe screws on the exterior, requiring a specialty screwdriver to remove.


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